HB05 Bonder with microscope and heater

Trade name
HB05 Wedge & Ball Bonder
Technical description

The HB05 Bonder equipped with an optical microscope and a heating stage, allows to make metallic connections between sample holder and sample using gold or aluminum wire with a thickness of 25 µm.

Conditions for providing infrastructure

The equipment is made available under the terms of the ACMiN Regulations on the Use of Research Infrastructure. (https://acmin.agh.edu.pl/acmin/dokumenty/).

Type of accreditation / certificate:
Not applicable
Access type
External
Research capabilities

The HB05 Bonder equipped with an optical microscope and a heating stage, allows to make metallic connections between sample holder and sample using gold or aluminum wire with a thickness of 25 µm.

Last update date
Jan. 29, 2024, 6:07 p.m.
Year of commissioning
2016
Measurement capabilities

Making connections between the sample and the holder using aluminum or gold wire with a diameter of 25 μm.

Available capillary types:

  • edge (Au and Al),
  • ball (Au).

Capillary pressure force 15 - 150 cN.

The maximum heating temperature of the table is 250 0C.

Minimum size of the contact: 50 x 50 µm.

Photos
Bonder HB05
Bonder HB05