DC magnetron vacuum sputtering system
Simple and functional sputter deposition unit for reproducible thin film layers applying. Optimized for co-deposition of TEM specimens. Main parameters: - Base pressure range 10-7 mbar - Process chamber diameter: Ø 355 mm - Substrate stage for up to 2″ diameter samples - Two 2” DC magnetrons - Two constant power sources - Ar gas automatic dosing by mass flow control - Manual throttle valve - Substrate temperature (25 – 600 °C) - Sample rotation (0 – 60 rpm) - QCM deposition rate monitor - TEM holder vacuum transfer system
On terms agreed with the Head of the Laboratory - dr hab. Eng. Adam Kruk, prof. AGH
deposition thin layers of metals, semiconductors and their alloys
Responsible body
Group / laboratory / team
Centre of Electron Microscopy for Materials Science