Transmission electron microscope (TEM) Tecnai TF 20 X-TWIN (FEI)

Trade name
Tecnai TF 20 X-TWIN (FEI)
Technical description

Tecnai TF 20 X-TWIN (200 kV) is a high-resolution transmission electron microscope equipped with a Field Emission Gun (FEG). The microscope enables imaging of the microstructure of a wide range of materials (such as: metals and their alloys, ceramics, semiconductors, polymers, composites) in bright field/dark field imaging modes. Observations of this type can be used to determine e.g. size, morphology and microstructure of particles/crystallites in the material, material defects, distribution and size-distribution of precipitates, thickness of coatings/layers. The high resolution of the microscope (point resolution ≤ 0.22 nm, information limit ≤ 0.14 nm) enables detailed imaging of nanostructures (nanoparticles, nanowires, nanolayers, quantum dots, etc.), as well as imaging of the atomic structure of materials (high resolution imaging). In addition, by means of electron diffraction (selected area diffraction) it is possible to: locally identify phases in specific micro-areas in the material, analyze the local orientation of micro-areas, or determine the crystallographic relationships between individual phases in the material. The microscope is also equipped with an integrated X-ray spectrometer (EDAX) used to analyze chemical composition of samples in micro-/nano- areas. Moreover, the microscope has the ability to work in the scanning-transmission mode (STEM) with the HAADF imaging detector.

The microscope is characterized by the following operating parameters:

- electron source with field emission - FEG

- accelerating voltage - 200 kV

- magnification range - 1025 - 900 k

- 2k CCD camera (Eagle 2k HR)

- detectors: EDAX RTEM 0.3 sr, HAADF

Conditions for providing infrastructure

Equipment is available in accordance with the Regulations for the Use of ACMiN's Research Infrastructure. (

Type of accreditation / certificate:
Not applicable
Access type
Research capabilities
  • Analysis of the morphology and size of grains/crystallites/particles, material defects, distribution and size distribution of precipitates, coating thickness, etc.
  • Analysis of the atomic structure of the material (interplanar distances, identification of structural defects)
  • Identification of phases occurring in a material, analysis of crystallographic orientation of microareas
  • Analysis of chemical composition in micro-/nano- areas.
Last update date
Jan. 24, 2024, 11:10 a.m.
Year of commissioning
Measurement capabilities

- bright field (BF), dark field (DF), high-resolution (HR) imaging

- imaging in the scanning-transmission mode (STEM) with use of an annular dark field detector (HAADF)

- selected area electron diffraction (SAED)

- EDS analyses (point, line or mapping).

Available holders: Double Tilt Low Background, Single Tilt

Available software: TEM Imaging & Analysis, Low Dose, K-space control, Smart tilt

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